multilayer
您现在的位置:
首页
/
/
/
Multi-layer Circuit

Multi-layer Circuit

 
Surface treatment: OSP
Board thickness: 1.2MM
Minimum aperture: 0.15MM
Aspect ratio: 8:1 core
Board thickness: 0.1MM (without copper)
Plate type: FR-4
Line width: 3mil/3mil
The minimum green oil bridg
特点: HDI 8 layer + BGA diameter 0.1mm + impedance + 3mil line
 
产品描述


Gn1yzbh_QsqdQl6tlj_yOQ.png

相关产品

荣晖电子(惠州)有限公司

微信公众号

微信公众号

荣晖集团

 

服务热线: 

江西公司地址:

Ronghui Industrial Park, Banshi Industrial Park, Anyuan County, Ganzhou City, Jiangxi Province, China

惠州公司地址:

中国广东省惠州市惠阳沙田镇长龙岗工业区

Copyright © 2020 Jiangxi Ronghui Electronics Co., LTD