Double-layer
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Hui ploughed circuit board for 18 years, with profound technology accumulation, advanced product design capabilities, and a number of well-known customers to establish long-term cooperation. At the same time, the company continues to carry out product innovation, extending upstream to the industry, focusing on the field of higher technical barriers, has obtained 22 utility model patents, and continues to increase investment in technology research and development to ensure a leading edge.

Double-layer

Double-layer

Process: OSP sink gold + sink gold gold finger
Board thickness: 1.6MM
Minimum aperture: 0.3MM
Aspect ratio 1:8
Surface ink: black oil
Minimum BGA diameter: 10mil (0.25mm)
Double-layer

Double-layer

Surface treatment: Shen Jin
Board thickness: 2.0MM
Minimum aperture: 0.2MM
Aspect ratio 1:8
Plug hole: 0.2-0.4
Minimum line width/line spacing: 4.0mil/4.0mil
Gold thickness: ≧3u〞

Ronghui Electronics (Huizhou) Co., LTD

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Ronghui Group

 

Service hotline: 

Jiangxi address:

Ronghui Industrial Park, Banshi Industrial Park, Anyuan County, Ganzhou City, Jiangxi Province, China

Huizhou address:

Changlonggang Industrial Zone, Shatian Town, Huiyang, Huizhou, Guangdong, China

Copyright © 2020 Jiangxi Ronghui Electronics Co., LTD